国家/地区 韩国（2）
IPC部 B（2）
IPC大类 C01（2） C25（2）
IPC小类 C01B（2）
IPC
发明人
公开年 2013（2）
申请年 2012（2）
专利权人

Method for transferring graphene on substrate used in electronic device, involves depositing graphene on side of metal substrate, and stacking target substrate on metal substrate-graphene layer to form stacked structure.

GONG K

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R