国家/地区 台湾（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人
公开年 2022（2）
申请年
专利权人

Electrolyte for electrodeposition of copper on semiconductor substrate, comprises copper ions, solvent, and amine that complexes copper ions and graphene.

MEVELLEC V, DOUSSOT C P, CAILLARD L

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q