国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C25（4） H01（2）
IPC小类 C25D（4）
IPC C25D003/38（4） C25D007/00（2） C25D015/00（2）
发明人
公开年 2021（4）
申请年 2021（4）
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing electrolyte solution for electrodeposition, comprises dispersing nanoparticles in aqueous solution comprising surfactant, thus forming dispersion of nanoparticle-surfactant micellar complexes in solution, and adding electrolytes.

ZHANG N, FANG F, ZHANG H

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S