国家/地区 中国（8）
IPC部 C（8）
IPC大类 F24（8）
IPC小类 F24D（8）
IPC F24D013/02（8）
发明人 PENG H（2）
公开年 2020（8）
申请年 2020（5）  2019（3） 
专利权人 GUANGDONG YU.（2）

Graphene electric heating tile comprises wear-resistant layer, decorative layer, insulating layer, and decorative layer is provided under wear-resistant layer and insulating layer is provided under decorative layer.

ZHANG D

Graphene layered composite floor heating board has honeycomb aluminum that is filled in metal thermal conductive layer, and electrode which is electrically connected with graphene electric heating filler.

DOU B, WANG X, SHEN Q

Producing graphene heating wallboard module involves sieving by-products of micropowder in the spherical graphite production process and placing in drying box for drying treatment, and then mixing the dried carbon powder and copper powder.

HUANG Z

Preparing graphene electric heating picture comprises e.g. preparing graphene heating body layer, preparing infrared reflection-insulation plate by bonding, coating, printing or vapor deposition on surface of one side of insulation plate.

TAN H, PAN Z, WANG F

Preparing platinum quantum dot doped graphene-based conductive ink useful in preparing graphene conductive film comprises mixing heteropoly acid and graphene oxide acetone dispersion, centrifuging, add structure stabilizer and dispersing.

WU L, YE D, HU Z, PENG L, ZENG C, KONG J, LIU Q, MA Y

Graphene far infrared negative ion warm core electric floor has inverted trapezoidal inclined surface whose upper portion and lower portion is provided with joint matched with concave interface and plug block matched with socket.

DAI M

Preparing heating tile comprises e.g. after the tiles are unpacked by a unpacker, washing and blow-drying, after mixing graphene or functionalized graphene with a water-based epoxy resin in stirred tank, and performing jet dispersion.

PENG H

Preparation of heating ceramic tile by mixing optionally functionalized graphene and polyimide resin, milling, purifying, spraying obtained heating coating on ceramic tile, curing, attaching conductive material, and coating protection layer.

PENG H