国家/地区 中国（6）
IPC部 F（6）
IPC大类 F24（6）
IPC小类 F24D（6）
IPC F24D013/00（3） F24D013/02（3） F24D019/10（3）
发明人 TANG Y（2） WU C（2） YU H（2）
公开年 2015（3） 2016（3）
申请年 2015（6）
专利权人 TANG Y（2） YU H（2）

Graphene self-heating floor has socket that is set between substrate plate and graphene slurry deliver heat conductive layer, and socket mounting slot whose sides are covered with electric conduction wire.

SHEN M, TAO Y

Graphene heating bottom plate integrated shell, has bottom plate provided with hem part, and inner heating core connected with shell body and pressing sheet, where inner heating core is fixed with bottom plate.

YE G

Semiconductor heating device, has semiconductor heating element provided with semiconductor heating plate and connected with hot end, and N-type semiconductor and P-type semiconductor made of graphene.

HUANG J, LIU W, TANG Y, TIAN Z, YU H

Semiconductor heating device, has P-type semiconductor and N-type semiconductor respectively arranged between heat end part and cold end part, where P-type semiconductor and N-type semiconductor are made of graphene material.

TANG Y, YU H

Graphene guide heat floor, has floor main body connected with multi-layer plate body, where multi-layer plate body is formed with graphite heat-conducting layer and graphene solution is coated on floor main body.

WU C

Graphene guide heat floor, has floor main body provided with multi-layer plate body that is coated with graphite heat-conducting layer, and electric heating wire and water pipe that are formed with mounting slot.

WU C