国家/地区 中国（2）
IPC部 F（3）
IPC大类 F28（3） G06（2） H01（2）
H05（2）
IPC小类 F28D（3）
IPC F28D015/02（3）
发明人
公开年
申请年 2020（3）
专利权人

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Solar building integrated PVT component, has photovoltaic battery assembly and micro-heat pipe array that are made of graphene heat-conducting material, and airfoil heat exchanger whose two ends are connected with insulating water tank.

LIU X, YANG L, CHAI Y, WEI W, GU J, KANG H, LIU Y