国家/地区
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC F28D015/04（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Flat heat pipe for use in heat dissipation of high power electronic device, has graphene interconnection array arranged in silicon carbide closed flat shell and for vertically growing with microporous structure of upper and lower inner surface of contact carbide close flat shell.

ZHANG Y, ZHAO Q

System for cooling concrete roof, has coolant liquid that is provided inside hollow elongated portion, and storing unit that circulates coolant to condensing unit is configured to condense gaseous coolant liquid.

TRIJO T, LAZARUS G A