国家/地区 美国（2）
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC F28D015/02（2）
发明人
公开年
申请年
专利权人

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Computing device comprises a set of components that includes a conductive sheet, which is provided with first graphene layer to dissipate a portion of heat, and second graphene layer that is used as an electrical ground.

MORRISON J T, FILES J W, NORTH T C