国家/地区 台湾（2）
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC F28D015/02（2）
发明人
公开年 2022（2）
申请年
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.

CHENG C, CHUNG M H