国家/地区 日本（4）
IPC部 F（4）
IPC大类 F28（4） B32（2） H01（2）
IPC小类 F28D（4）
IPC
发明人
公开年 2015（2）
申请年 2014（2） 
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Atomization apparatus unit for atomizing sample, has cooling flow path into which cooling water flows is formed in inner side of first pipe and inside third pipe, and atomization process flow path through which sample flows inside second pipe.

SANO K, SASAKI R

System for extracting and distributing geothermal heat energy, has graphene-enriched product that is provided with graphene contacts heat source for conduction of heat.

BHARGAVA M

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K