国家/地区 台湾（5）
IPC部 F（5）
IPC大类 F28（5） H05（4） G06（2）
IPC小类 F28D（5）
IPC H05K007/20（4） F28D015/04（3） G06F001/20（2）
发明人 CHEN Y（2） HONG Y（2） HORNG A（2）
公开年 2021（5）
申请年 2020（5）
专利权人 SUNONWEALTH .（2）

Uniform temperature plate for use in radiating device for radiating electronic component, has protective layer connected to outer surface of heat conducting sheet, where thickness of protective layer is in specific range.

CHEN Y, YEH C, HONG Y, HORNG A

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y