国家/地区
IPC部 F（2）
IPC大类 F28（2） H05（2）
IPC小类 F28D（2）
IPC H05K007/20（2）
发明人
公开年 2022（2）
申请年 2020（2）
专利权人

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Carbon-based flexible high thermal conductivity heat transfer mechanism useful for transferring heat from heat source to heat sink e.g. radiator, comprises heat conducting belt body used as fast transmission path of heat and heat conducting belt joint for ensuring minimum contact thermal resistance.

HE Y