国家/地区 中国（3） 韩国（2） 美国（2）
IPC部 B（5） F（5） H（2）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B003/26（3） B32B009/00（3） B32B001/08（2）
B32B007/12（2） B32B009/04（2） B32B027/08（2）
B32B027/36（2） B32B027/40（2） B32B033/00（2）
H05K007/20（2）
发明人
公开年 2022（5）
申请年 2020（3）  2021（2） 
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Apparatus for improving flow in pipelines, has air gap that provides upward movement of polyethylene terephthalate (PET) layer using opposite forces of alternate sides of PET layer, and configuring graphene layer to surround shell.

RAYNEL G R J, VILLETTE T T

High thermal conductivity and low gas permeability fluororesin tube useful for heat exchanger comprises fluororesin, thermally conductive flat filler and filler in form of nano-sized thermally conductive fibers.

CHOI J H

Carbon-based flexible high thermal conductivity heat transfer mechanism useful for transferring heat from heat source to heat sink e.g. radiator, comprises heat conducting belt body used as fast transmission path of heat and heat conducting belt joint for ensuring minimum contact thermal resistance.

HE Y

Heat storage ceramic tile, has ceramic tile main body whose top part is provided with ceramic surface skid-proof layer, and heat storage layer whose inner part provided with thermocouple and other side provided with telescopic hole.

WANG Y, ZHANG H, SHENG Y