国家/地区 美国（3）
IPC部 F（3）
IPC大类 F28（3） B32（2）
IPC小类 F28D（3）
IPC B32B003/26（2）
发明人
公开年 2022（3）
申请年 2021（2） 
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Graphene and carbon nanotube based thermal management device, has heat sink base and heat sink fins comprising single element formed from graphene layers with nanotubes interposed between graphene layers.

GOERGEN J R, ACHKIR D B, CAP M O, DOGRUOZ M B

Apparatus for improving flow in pipelines, has air gap that provides upward movement of polyethylene terephthalate (PET) layer using opposite forces of alternate sides of PET layer, and configuring graphene layer to surround shell.

RAYNEL G R J, VILLETTE T T