国家/地区 中国（4）
IPC部 F（4）
IPC大类 F28（4） H05（2）
IPC小类 F28D（4）
IPC F28D015/04（4）
发明人
公开年 2021（4）
申请年 2020（3） 
专利权人

Flat heat pipe for use in heat dissipation of high power electronic device, has graphene interconnection array arranged in silicon carbide closed flat shell and for vertically growing with microporous structure of upper and lower inner surface of contact carbide close flat shell.

ZHANG Y, ZHAO Q

Thin-type uniform temperature plate coated with graphene, has heat absorbing plate and radiating plate that are covered with each other, where side of heat absorbing plate and radiating plate are arranged far away from groove that is sprayed with graphene layer.

CHEN X

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

Graphene vinyl chloride soaking plate, has capillary core layer formed between upper layer plate and lower layer plate, where inner portion of lower layer plate is provided with filling chamber.

LI G, ZHANG C