国家/地区 台湾（2）
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC
发明人 CHENG C（2）
公开年
申请年
专利权人

Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.

CHENG C, CHUNG M H

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C