国家/地区 中国（7）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（8）
发明人
公开年 2021（6）
申请年 2021（8）
专利权人

Composition useful for preparing light-shielding film of smartphone camera module as spacer, washer and coating solution comprises carbon-based particles, thermosetting binder resins, dispersants, polymer beads and solvents.

PARK S C, YUN J H, KIM Y S, KIM Y, PIAO S

Thermally conductive composite material used in virtual reality device, comprises polyamide 6, elastomer and thermally conductive filler comprising aluminum nitride, graphite, boron nitride, and/or graphene.

FANG X, LIU M, LIU P, REN Y

Prism resin for laminated film, comprises polybutadiene acrylate, tackifying resin, active diluent, graphene oxide-modified nano-zirconium oxide, photoinitiator, and thermal initiator.

CAO L, GUO K, NIU M

Antistatic reflecting film of mini-LED backlight module comprises micro-bubble core layer, where one surface of core layer is compounded with light diffusion upper layer, and the other surface with antistatic lower layer.

LUO Q, LUO P

Thermal deformation support arm used for controlling space reflector unfolding state, and obtained by blending bidirectional shape memory polymer matrix phase and matrix enhanced phase by physical method.

CHENG Z, JIAO S, CHI D, ZHANG D, LIU Y, GUO X, KANG W

Rubber compound useful in hybrid carbon black grade for e.g. manufacturing tire tread and tire side wall, comprises hybrid carbon black grade comprising carbon black and filler, and nano-structured carbon, reduced graphene oxide and filler.

TALUKDAR A, KUNTI N, CHAKRABARTI A, MOUKWA M, PATEL S

All dielectric self-supporting optical cable with anti-tracking corrosion comprises intermediate reinforcement, tight-buffered optical fiber, water blocking layer, inner sheath, non-metal reinforcement and outer sheath.

XU S

Quantum dot diffusion plate comprises polystyrene, polycarbonates, and/or polymethyl methacrylate plastic particles quantum dot additive molded in an extrusion molding machine and composed of quantum dots covered with graphene.

CAI W