国家/地区 世界知识产权组织（40）
IPC部 C（40）
IPC大类 C09（40）
IPC小类 C09D（19） H01L（18） C08K（14）
H05K（13） C09K（12） H01B（12）
C08L（11） H01M（11） C09J（10）
C01B（7） C08J（7） C08F（6）
B82Y（5） C08G（4） C09C（4）
IPC C08K003/04（11） C09D011/52（10） C01B032/194（5）
C09D007/61（5） C09J011/04（5） C09J163/00（5）
H01B001/22（5） H01B001/24（5） H01L023/373（5）
H01M004/62（5） H05K007/20（5） B82Y040/00（4）
C08J005/18（4） C08K003/22（4） C09D005/24（4）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） DAIGLE J（2） ESTRUGA O M（2）
ESTRUGA ORTIGA M（2） ESTRUGAORTIGAMARQUE（2） HENCKENS A（2）
NAITO T（2） SHIRATORI K（2） SYLVESTER K T（2）
TSUKADA Y（2） YAJIMA A（2） ZHANG X（2）
公开年 2022（40）
申请年 2021（25）  2022（12）  2020（3） 
专利权人 LINTEC CORP（3） HENKEL AG C.（2） HYDROQUEBEC（2） KANSAI PAINT.（2）
NISSAN MOTOR.（2） PPG IND OHIO.（2）

Composite material used in solid electrolyte in electrochemical cell such as electrochemical accumulator such as lithium battery and lithium-ion battery, comprises inorganic particles, fluorinated compound, and optionally polymer.

ZHANG X, DAIGLE J, KIM C

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Manufacturing conductive pigment paste includes dispersing paste containing pigment dispersion resin, conductive pigment and solvent by at least one disperser selected from bead mills, homogenizers, ultrasonic dispersers, kneaders, extruders, and planetary mixers.

ENDO K, HASHIMURA M, KITAMURA T, YUKAWA Y, YUGAWA Y

Dispersant used in composition for forming conductive material slurry, comprises copolymer comprising an acrylate structural unit, vinyl-based structural unit, and acrylamide structural unit.

AKITO I, YUTARO K, KYOICHI S, IBI A, KINOSHITA Y, SHIROTA K

Fluoropolymer binder for lithium-ion battery, comprises mixture of phase of polytetrafluoroethylene formed of primary polytetrafluoroethylene particles and phase of polyvinylidene fluoride formed of primary polyvinylidene fluoride particles.

BONNET A, FINE T

New substituted indacenetetrone compounds used in e.g. photoelectric conversion layer, organic and/or hybrid module for optoelectronic application e.g. image sensor and organic photovoltaics comprising organic photoelectric conversion layer.

DANNER D, DEICHMANN V A F, ROBERTS A, CHERCKA D, ROSSELLI S, WEGNER B, KNORR N, YAKUTKIN V, MITEVA T, NELLES G

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H