国家/地区 韩国（3）
IPC部 B（3）
IPC大类 B82（2）
IPC小类
IPC
发明人
公开年 2023（3）
申请年 2021（3）
专利权人 KOREA INST SCI TECHNOLOGY（3）

Composite structure used for electronic device, comprises layer comprising molecular mechanical material whose shape is deformed in response to external stimulus, and layer including two-dimensional material having specific crystal structure which is deformed accompanying deformation of above layer.

SON J Y, PARK S K, IK S D

Carbon fiber reinforced composite material comprises laminated carbon-reinforced fiber sheets, and heat transfer layer disposed between carbon-reinforced fiber sheets and including fillers.

RYU J S, BAE K, OH Y N, JUNG H N, YOU N H, YANG C M, MINGOOK K, LEE M W, NA W

Composite structure comprises cellulose-derived carbon layer and metal layer present on cellulose-derived carbon layer.

SU J, SONG J Y, JUNG H T, KIM C, KIM C S, JEONG H S