国家/地区 中国（6）
IPC部 C（6） H（6）
IPC大类 C08（6）
IPC小类 C08J（6） C08K（6） C08L（6）
H05K（5）
IPC C08J005/18（6）
发明人
公开年 2023（6）
申请年 2022（6）
专利权人

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Preparation of composite heat-conducting film for preparing heat dissipation component of electronic device, involves adding carbon nanotube dispersion to aramid nanofiber aqueous dispersion to form modified dispersion liquid, compounding with graphene dispersion, filtering, drying and heat-treating.

ZHANG D, DIAO R, WANG Y

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Preparation of graphene oxide thermally conductive film by dispersing graphene oxide, nanocellulose and polysorbate 20 in deionized water, adding aqueous-based epoxy resin and curing agent to disperse, forming layer of graphene oxide, and coating slurry gel system thermally conductive film.

CHEN D

Preparing graphene-based electrothermal film useful in clothes, comprises e.g. mixing poly-p-phenylene benzobisoxazole nanofibers with graphene nanosheets, coating conductive silver glue, covering insulating protection layer on electric heating layer, and covering packaging layer and pressing.

ZHOU M, PAN Z, ZHANG X

Corrosion-resistant light high-conductive carbon-based flexible conductive shielding film useful for electronic product including adhered to chip surface and mobile phone gap comprises resin slurry, conductive base material and auxiliary agent.

CHEN L, ZHANG H, XIE H, WU J, LI W, XU S