国家/地区 中国（2）
IPC部 C（2） H（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D007/00（2）
发明人
公开年 2023（2）
申请年
专利权人

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y