国家/地区 美国（4）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B009/00（2） B32B027/00（2） B32B027/20（2）
C08K003/04（2）
发明人
公开年 2023（4）
申请年 2022（4） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Hollow carbon fiber tube, formed by winding composite material body, composite material body comprising multiple carbon fiber prepreg layers; and one graphene-containing resin layer, where each of graphene-containing resin layer is disposed between two adjacent carbon fiber prepreg layers.

LI M, LIOU S, LIU S

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J