国家/地区 美国（3）
IPC部 B（3） C（3） H（2）
IPC大类 B32（3） C08（3）
IPC小类 B32B（3）
IPC C08K003/04（3）
发明人
公开年 2023（3）
申请年 2022（3） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Semiconductive polyolefin composition in power cable, comprises olefin polymer base resin, first carbonaceous structures, carbon black and/or second carbonaceous structures, and optionally additives, where first carbonaceous structures are selected from graphene, and modified graphene.

THEODORIDIS A, MANIKA G, KADAR R, GKOURMPIS T

Hollow carbon fiber tube, formed by winding composite material body, composite material body comprising multiple carbon fiber prepreg layers; and one graphene-containing resin layer, where each of graphene-containing resin layer is disposed between two adjacent carbon fiber prepreg layers.

LI M, LIOU S, LIU S