国家/地区 中国（2） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C09（5） H05（3） C08（2）
H01（2）
IPC小类 C09D（5）
IPC C09D011/03（5）
发明人
公开年 2023（5）
申请年 2022（3）  2021（2） 
专利权人

Conductive ink composition useful in transparent conductive film, comprises 2,4-toluene diisocyanate, polyethylene glycol, epoxy resin, conductive carbon black, conductive graphite, curing agent, solvent, and dispersant, where epoxy resin is bisphenol-A-type epoxy resin epoxy resin.

WANG D

Manufacturing conductive ink useful in circuit board for next generation electronic device comprises e.g. mixing guar gum, xanthan gum, or hydroxyethyl cellulose with heated solvent, and mixing ethylene glycol, or propylene glycol.

HYOYOUNG M

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M