国家/地区 中国（6）
IPC部 B（6）
IPC大类 C09（6） B32（3） H01（3）
B01（2） B29（2） B82（2）
C01（2） C08（2） F28（2）
IPC小类 C09K（6） B32B（3） H01M（3）
B29C（2） B82Y（2） C01B（2）
C08K（2） C08L（2） F28F（2）
IPC C09K005/14（6）
发明人 LEE M（2）
公开年 2015（4） 2014（2）
申请年 2014（6）
专利权人

Production of graphene involves applying physical force to liquid dispersion of dispersing agent containing polyaromatic hydrocarbon oxide, and carbon-based material comprising graphite, and forming graphite into nano graphene flakes.

SOHN K N, YOO K H, KWON W J, LEE K S, YANG S B, KIM I Y, LEE M J, LEE J Y, SOHN K, YOO K, KWON W, LEE K, YANG S, KIM I, LEE M, LEE J, LI M, LI J

Thermally conductive polycarbonate composite material contains mother particles that comprise porous polycarbonate powder, carbon black, graphene, carbon nanotube and compatibilizer, in specified weight ratio.

LI H, QI B, MA S

Producing thermally conductive material useful for e.g. various electrical appliances, involves mixing nano-diamond, layered graphene nanosheets and thermally conductive filler, extruding and granulating, and injection molding.

LIN Z, XU B

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Silicon glue heat conducting structure has silicon resin layer that is connected with adhesive layer, and graphene conducting film that is directly connected with heat cover and silicon resin layer.

WU F

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X