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Processing technology of medicinal composite film based on temperature-sensitive technology comprises e.g. coating adhesive on one side of polyester film layer to form first adhesive layer, compounding polyvinylidene chloride film layer with first adhesive layer, and curing.
ZHOU S, ZHANG C, GU S
Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.
CHANG C, WU Y, ZHANG C
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