国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09J（2）
IPC C09J011/04（2）
发明人 LI R（2）
公开年 2022（2）
申请年 2022（2）
专利权人

Thermally conductive adhesive used for bonding electronic circuit base plate for circuit board, comprises composite resin, thermally conductive filler, vinyl-terminated silicone oil, platinum catalyst, curing agent and leveling agent.

ZHONG L, LI R

Eco-friendly adhesive protection gluing agent for compound backing plate of circuit board, comprises epoxy resin, chloroprene rubber, modified filler, coupling agent, solvent, curing agent, chlorinated graphene, water glass, polyvinyl alcohol, antioxidant and inorganic powder.

ZHONG L, LI R