国家/地区 中国（6）
IPC部 B（6）
IPC大类 C08（6） B29（3）
IPC小类 C08K（6） C08L（6） B29C（3）
C08J（3） B29B（2）
IPC C08K013/04（6）
发明人
公开年 2021（6）
申请年 2021（6）
专利权人

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Preparing acrylonitrile styrene acrylate film used for outdoor application, by adding acrylonitrile styrene acrylate rubber powder, calcium carbonate powder, hollow glass beads, pigment, lubricating dispersant and light stabilizer to main material, melting and extruding, casting and winding.

LV Z

Bicycle saddle comprises cushion comprising main component, which includes PVC resin, elastomer, plasticizer, glass beads, crosslinking agent, heat stabilizer, antioxidant, and foaming agent.

SUN Z

Preparing oil-resistant and anti-radiation high-performance silicone rubber involves selecting methyl vinyl phenyl silicone rubber raw rubber, methyl vinyl trifluoropropyl silicone rubber, fumed silica, benzoyl peroxide and magnesium oxide.

WANG Q, GAN T, WANG L, FENG X, WU J, CHEN C

Material useful for building 3D printing fast forming comprises raw material including e.g. carbon black, graphene, clay, alkali-resistant glass short fiber, photoinitiator, polyvinyl alcohol and coupling agent, and water.

LIU H, WU C

Flame-resistant ABS plastic comprises intrinsic graphene, carbon source, blowing agent, catalyst, dilution agent, magnesium carbonate, flame retardant, polypropylene, expanded vermiculite and melamine resin.

HU J, ZHU L, CAO S, TAO X, FU S, DI R, GAO X