国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08G059/50（3）
发明人
公开年 2019（3）
申请年 2019（2） 
专利权人

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Conductive epoxy resin comprises bisphenol A type epoxy resin, amine curing agent, conductive filler comprising carbon nanotubes, and another conductive filler comprising graphene oxide, silane coupling agent and heat stabilizer.

XU D, FU Z, YAO W, WANG X, LI S, PAN G, LIU F, SHI T, DOU Y, GUAN D

Preparing long-chain cured epoxy/graphene composite film involves uniformly dispersing graphene in acetone, and uniformly mixing by ultrasonic vibration to obtain uniformly dispersed graphene suspension.

MENG Q, ZHAO Y, LIU Z, HAN S, WANG Y