国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09J（3）
IPC C09J011/04（3）
发明人
公开年 2017（3）
申请年 2016（3）
专利权人

Low-density high-conductivity potting adhesive comprises silicone polymer, thermally conductive powder, low density powder and additive, where low density powder is selected from hollow silica, aerogel and/or graphene powder.

DAI S

Preparation of oxidized graphene-modified LED thermally conductive potting adhesive used for e.g. circuit modules involves dispersing graphene oxide in vinyl polydimethylsiloxane, stirring with crosslinking agent and catalyst, and reacting.

HE J, ZHANG J, LUO X, HE Z, ZHAO Z, LI J, KANG W, YANG W, DING Y

UV-radiating printed circuit board organic silicone electronic pouring sealant includes terminal vinyl silicone oils, platinum catalyst, ethynyl cyclohexanol, vinyl silicone resin, 1-allyloxy-2,3-epoxypropane, and graphene.

DONG Y, HE X, JIANG L, LI T, LIU C, WANG L, WU D, XIE J, ZHANG X