国家/地区 中国（7）
IPC部 C（7）
IPC大类 C09（7）
IPC小类 C09J（7）
IPC C09J183/07（7）
发明人 ZHANG J（2）
公开年 2021（3）
申请年 2022（2） 
专利权人

Condensed type fast thermosetting silicone rubber adhesive used e.g. for bonding space flexible and foldable solar cell and double-glass or single-glass solar cell plate on land, comprises condensation-type liquid silicone rubber and graphene sheets and/or their derivatives curing agent.

YU H, LU Q, SUN Y, SUN P, LIU L

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Encapsulation adhesive film comprises first adhesive film substrate and multiple organic high refractive index portions, where organic high refractive index portions are arranged at intervals on surface of first adhesive film substrate.

WEI M, WANG F, ZHOU G

LED packaging glue comprises vinyl silicone oil, phenyl silicone oil, vinyl silicone resin, platinum catalyst, dendrimer graphene composite material, dendrimer gold/silver nanocrystalline composite material and vinyl silicone oil.

LUO Y, GUO Q, YI B, ZHANG J, WU X

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y

Preparation of oxidized graphene-modified LED thermally conductive potting adhesive used for e.g. circuit modules involves dispersing graphene oxide in vinyl polydimethylsiloxane, stirring with crosslinking agent and catalyst, and reacting.

HE J, ZHANG J, LUO X, HE Z, ZHAO Z, LI J, KANG W, YANG W, DING Y

Substrate for flexible photoelectric device comprises a flexible substrate e.g. an ultraviolet light curable silicone adhesive, and a conductive layer e.g. a silver nanowire thin film, whose gap is filled with graphene.

HUANG J, JIANG Y, LIU S, YU J