国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3） C08（3）
IPC小类 B32B（3）
IPC C08K003/04（3）
发明人 CHEN Y（3）
公开年 2022（2）
申请年
专利权人 JIANGSU YAO .（2）

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Easy-to-peel multilayer ceramic chip capacitor release film comprises at least two layers of co-extruded and stretched films, comprising polyethylene terephthalate, and functional masterbatch (comprised of modified inorganic materials and polyethylene terephthalate).

LIU J, FAN G, WANG Y, YUAN W, CHEN Y