国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2） C08（2）
IPC小类 B32B（2）
IPC B32B015/092（2）
发明人 CHAI S（2）
公开年 2014（2）
申请年 2013（2） 
专利权人 GUANGDONG SH.（2）

Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.

CHAI S, SU X

Prepreg for laminate used for printed circuit board comprises reinforcing material which is impregnated by thermosetting resin composition and dried in which reinforced material is graphene oxide or graphene subjected to coating process.

SU X, CHAI S