国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3） C08（3）
IPC小类 B32B（3）
IPC C08L063/00（3）
发明人 LIU J（3）
公开年
申请年
专利权人

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M

Preparing thermal-insulating graphene electrothermal film by mixing and heating silicone acrylic emulsion and aqueous-based fluorocarbon emulsion, and coating one side of thermal insulation bottom layer with graphene electrothermal film.

HUANG Z, XIA Y, LIU J, JIANG J