国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） C22（2）
IPC小类 C25D（5）
IPC C25D005/54（5）
发明人
公开年 2018（4）
申请年 2018（5）
专利权人

Forming electroplated copper on non-metallic material surface by preparing graphene-based electroplating ink, spraying ink on surface of non-metallic material, drying, soaking material in electroplating solution and applying current.

GU G, ZHANG G, LAI Z

Preparation of high strength and high conductivity copper-based composite material comprises taking oxidized graphene aqueous solution, adding hydroiodic acid, reacting, plating, and hot press molding under protection of argon gas.

HU X, HU Y, MA X, YU J, CENG H, WEN Y

Graphene metal solution useful as backing conductive layer for metallization of non-metallic surfaces, comprises graphene or graphene oxide, film forming agent, dispersing agent, anionic surfactant, pH adjuster and water.

CHEN W

Preparing thin-wall aluminium alloy involves taking copper, manganese, magnesium, zinc, chromium, titanium, silicon, iron, 5-8 graphene and balanced amount of water, immersing graphene in liquid furan resin, and then taking out and drying.

XIE Z, LI K

Preparing graphene oxide-cobalt nanocrystal-diamond film involves carrying out silicon wafer pretreatment by ultrasonically cleaning silicon wafer in analytical pure methanol, and placing silicon wafer in hydrofluoric acid aqueous solution.

ZHOU S, ZHU X, YAN Q, MA L