国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3） C08（2） C09（2）
IPC小类 C25D（3）
IPC C25D005/56（3）
发明人 WU B（3）
公开年 2023（2）
申请年 2022（2） 
专利权人 UNIV XIAMEN（3） TAN KAH KEE .（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Plastic plating comprises coating the surface of plastic substrate with graphene-based conductive ink, curing graphene-based conductive ink to form graphene-based conductive ink layer, electroplating after depositing and drying.

ZHENG N, MAO H, WU B, CAO F