国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC C09D005/24（2）
发明人
公开年
申请年 2019（2）
专利权人

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Polymer heating film for heated plastic, comprises base film, overmolded bonding layer and flexible conductive coating comprising aqueous polyurethane, graphene conductive paste, carbon black paste, composite dispersant and stabilizer.

YAN L, XU Y, LING Q