国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） B82（2） C09（2）
F28（2） H05（2）
IPC小类 C25D（5）
IPC C25D003/38（5）
发明人 CHEN W（2） ZHOU M（2）
公开年 2019（5）
申请年 2019（4） 
专利权人 SHANDONG XIT.（2）

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A

Micro-channel radiator used to condition air, comprises graphene heat-dissipating coating coated on surface of fin of radiator and containing electro-treated graphene, silicon oxide nanofiber material and nano copper particles.

CHEN W, ZHOU M

Graphene heat dissipation coating comprises electrically treating graphene, silicon oxide nanofiber material and nano copper particles, nano copper particles are deposited by electrodeposition in composite material formed.

CHEN W, ZHOU M

Directly plating circuit board based on graphene film comprises e.g. heating graphene oxide containing a specific functional group, dispersing heat-treated graphene oxide in an aqueous solution, ultrasonically stirring and centrifuging.

ZHOU Q, SONG W, LIU G, PAN Z, HU G, WEI Z

Printed circuit board (PCB) with graphene-metal composite material as conductive line for motor, has underlying conductive wire that is provided on surface of substrate sheet and has graphene-metal composite layer.

HUANG Y, LIU H, ZHENG X