国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D005/48（2）
发明人 LIN Z（2）
公开年
申请年
专利权人

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Sealing structure for copper column convex point, has copper pillar formed on surface of reduced oxide graphene layer, and metal barrier layer formed on surface of copper pillar, and solder bump formed on surface of metal barrier layer.

LIN Z, TANG H