国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C30B（3）
IPC
发明人
公开年 2022（3）
申请年 2021（2） 
专利权人

Etching method of single-sided germanium wafer by coating photoresist on front, back and circumferential directions of germanium wafer respectively to form photoresist film, exposing photoresist film on front side, and developing.

HE Y, CHEN M, WANG Y

Seed crystal adhesive used for seed crystal bonding, comprises adhesive and graphene.

HUANG X, ZHAO X, LUO Y, YANG M

Assembly method of plant device containing lead-free double perovskite quantum dot crystal involves preparing lead-free double perovskite quantum dot crystal, packaging the lead-free double perovskite quantum dot crystal.

CHEN Q, SHI M, ZOU J, JIN D, WAN W, ZHOU Y