国家/地区 中国（4）
IPC部 F（4） H（4） C（2）
IPC大类 F28（4）
IPC小类 F28D（4）
IPC H05K007/20（3）
发明人
公开年 2022（3）
申请年 2021（4）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Composition for porous graphene comprises graphene heating film, where one graphene of the heating film is provided with heat storage layer, and heating graphene and the storage layer are covered on the upper layer protection layer.

DUAN Z

Preparation method of nano liquid absorbing core for intelligent product or electronic product, involves taking metal core and in situ growing graphene with hydrophilic functional groups on surface of the metal core.

JIA Y, WU Q, MA Y

Heat exchanger for air conditioner, has heat exchanger main structure whose outer surface is coated with radiating layer, radiating layer that comprises graphene material, and graphene which comprises carbon element and non-carbon element.

WAN K, CHEN W, LIN L