国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B007/12（2） H05K007/20（2）
发明人
公开年 2022（2）
申请年
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Carbon-based flexible high thermal conductivity heat transfer mechanism useful for transferring heat from heat source to heat sink e.g. radiator, comprises heat conducting belt body used as fast transmission path of heat and heat conducting belt joint for ensuring minimum contact thermal resistance.

HE Y