国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09C（2）
IPC C09C003/10（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Modifying printed circuit boards by ball milling with silicate fillers comprises e.g. adding coupling agent compounding agent to compound silicate, performing heat treatment, sending to ball mill for ball milling, washing using water and drying, performing heat treatment, and cooling.

ZHANG G, ZHOU W

Modified inorganic particle useful in preparing epoxy resin, prepared by e.g. modification of tannin-based aqueous derivatives and carbon black, carbon nanotubes, ultrasonically dispersing tannin-based aqueous epoxy-modified nanoparticle in water and post-processing.

NIE X, HUANG J