国家/地区 中国（2）
IPC部 B（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 MA Y（2）
公开年 2023（2）
申请年
专利权人

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K