国家/地区 法国（2）
IPC部 B（2）
IPC大类 B29（2） C08（2） C09（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人 ARKEMA FRANC.（2）

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Producing graphene based composite material used to e.g. manufacture composite product, by introducing graphene and polymeric composition with thermoplastic polymer into mixer, and melting polymer and mixture of molten polymer and graphene.

BEAUSOLEIL J, BORDERE S, DELPRAT P, GAILLARD P, KORZHENKO A