国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4） C09（4） F21（4）
IPC小类 C08K（4） F21V（4） C09D（3）
IPC F21V029/87（4）
发明人
公开年 2021（3）
申请年 2021（3） 
专利权人

Heat-dissipating coating composition useful for producing LED lighting luminaire, comprises carbon nanotubes, epoxy resin, dispersibility improving copolymer, photoinitiator, and thermally conductive material.

PARK J, KWON Y K

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E

Heat dissipation paint composition for preparing LED lighting fixture comprises boron nitride powder pretreated with ammonia plasma and an epoxy resin.

KIM S W, LIM J J

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z