国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B005/02（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Assembly for a battery, includes thermal management multilayer sheet equipped on surface of an electrochemical cell, and thermal management multilayer sheet comprising thermally-insulating layer.

CHURCHILL C, DAIGLE R C, KILHENNY B, DAGLE R