国家/地区 台湾（5）
IPC部 C（5） B（3） H（3）
A（2）
IPC大类 C09（5） C01（3） C08（3）
A61（2） B82（2） H01（2）
IPC小类 C09D（5）
IPC C09D011/52（5）
发明人
公开年 2022（3） 2021（2）
申请年 2021（5）
专利权人

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Nanocarbon dispersion used in resin composition for forming composite material for e.g. solder paste flux, automobile cables, polyacrylonitrile-based carbon fiber blended products, pressure sensors and rubber/resin composite materials, comprises nanocarbon and rosin or its derivative as dispersant.

HIROYOSHI K, MASATO S, YUJI K, SHIRATORI M, KAWAMATA Y, KAWASAKI H

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P