国家/地区 世界知识产权组织（3）
IPC部 B（3）
IPC大类 B29（3）
IPC小类 C09D（3）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人 ARKEMA FRANCE（3）

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Photocurable composition used in ink composition for three-dimensional printing, comprises monomer composition comprising at least one monomer having preset refractive index, crosslinker, and plasticizer.

STOLZ Y, FEILLEE N, STOLTZ J, FAYRAY N

Producing graphene based composite material used to e.g. manufacture composite product, by introducing graphene and polymeric composition with thermoplastic polymer into mixer, and melting polymer and mixture of molten polymer and graphene.

BEAUSOLEIL J, BORDERE S, DELPRAT P, GAILLARD P, KORZHENKO A