MATERIALS LETTERS

LI PL, COLLOMB D, BENDING S

2D MATERIALS

MELIOS C, GIUSCA CE, PANCHAL V, KAZAKOVA O

MICROELECTRONIC ENGINEERING

ROBERTSON J, ZHONG G, ESCONJAUREGUI S, ZHANG C, HOFMANN S

SYNTHETIC METALS

TAN YY, TAN LW, JAYAWARDENA KDGI, ANGUITA JV, CAREY JD, SILVA SRP

PHYSICA STATUS SOLIDIRAPID RESEARCH LETTERS

KIDAMBI PR, BAYER BC, WEATHERUP RS, OCHS R, DUCATI C, SZABO DV, HOFMANN S

NANOTECHNOLOGY

CABREROVILATELA A, ALEXANDERWEBBER JA, SAGADE AA, ARIA AI, BRAEUNINGERWEIMER P, MARTIN MB, WEATHERUP RS, HOFMANN S

ELECTRONICS LETTERS

CHOW KK

CARBON

MELIOS C, CENTENO A, ZURUTUZA A, PANCHAL V, GIUSCA CE, SPENCER S, SILVA SRP, KAZAKOVA O

IET CIRCUITS DEVICES SYSTEMS

GONISZEWSKI S, GALLOP J, ADABI M, GAJEWSKI K, SHAFOROST O, KLEIN N, SIERAKOWSKI A, CHEN J, CHEN YF, GOTSZALK T, HAO L

IET CIRCUITS DEVICES SYSTEMS

AWAN SA, PAN GH, AL TAAN LM, LI B, JAMIL N